microTECH Global
Job title:
3D Integration Program Director
Company
microTECH Global
Job description
Are you an expert in 3D integration, semiconductor manufacturing, and cutting-edge materials? Ready to drive innovation in AI, 5G, and next-gen networking? We’re looking for a 3D Integration Program Director to lead high-impact R&D projects that shape the future of telecom and beyond!What You’ll Do:
– Lead breakthrough projects in AI/CPU, networking, and 3D engineering.
– Design and implement cutting-edge 3D engineering architectures.
– Turn complex ideas into reality by managing risks and executing technical roadmaps.
– Collaborate globally with top industry experts to push the boundaries of 3D technologies.
– Apply your expertise in 3D IC, advanced packaging, chip stacking, and semiconductor tech.What You Bring:
– PhD in Engineering, Materials Science, or a related field.
– 10+ years of experience in 3D integration, semiconductor manufacturing, or advanced materials.
– Deep knowledge of 3D IC technologies, heterogeneous integration, MEMS, and chip stacking.
– Strong leadership & communication skills to work with top-tier researchers and engineers.
– A problem-solving mindset with the ability to manage complex, high-stakes projects.Why Join Us?
– Work at the forefront of innovation in AI, 5G, and advanced networking.
– Collaborate with global experts and lead game-changing research.
– Be part of a company driving next-gen digital transformation.Are you ready to lead the future of 3D integration? Apply now and let’s innovate together!
Expected salary
Location
Leuven, Vlaams Brabant
Job date
Fri, 21 Feb 2025 23:22:25 GMT
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